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  datasheet 9fgl04 october 19, 2016 1 ?2016 integrated device technology, inc. 4-output 3.3v pcie clock generator 9fgl04 description the 9fgl04 devices are 3.3v members of idt's 3.3v full-featured pcie family. the devices have 4 output enables for clock management and support 2 different spread spectrum levels in addition to spread off. the 9fgl04 supports pcie gen1-4 common clocked architectures (cc) and pcie separate reference no-spread (srns) and separate reference independent spread (sris) clocking architectures. the 9fgl04p1 can be programmed with a user-defined power up default smbus configuration. recommended application pcie gen1-4 clock generation for riser cards, storage, networking, jbod, communications, access points output features ? 4 ? 100 mhz low-power hcsl (lp-hcsl) dif pairs ? 9fgl0441 default z out = 100 ? ? 9fgl0451 default z out = 85 ? ? 9fgl04p1 factory programmable defaults ? 1 - 3.3v lvcmos ref output w/wake-on-lan (wol) support ? easy ac-coupling to other logic families, see idt application note an-891 key specifications ? pcie gen1-2-3-4 cc-compliant ? pcie gen2-3 sris-compliant ? dif cycle-to-cycle jitter <50ps ? dif output-to-output skew <50ps ? dif 12k-20m phase jitter is <2ps rms when ssc is off ? ref phase jitter is <300fs rms (ssc off) and < 1.5ps rms (ssc on) ? 100ppm frequency accuracy on all clocks features/benefits ? direct connection to 100 ? (xx41) or 85 ? (xx51) transmission lines; saves 16 resistors compared to standard pcie devices ? 142mw typical power consumption (@3.3v); eliminates thermal concerns ? smbus-selectable features allows optimization to customer requirements: ? control input polarity ? control input pull up/downs ? slew rate for each output ? differential output amplitude ? 33, 85 or 100 ? output impedance for each output ? spread spectrum amount ? 41 and 51 devices contain default configuration; smbus interface not required for device operation ? p1 device allows factory progr amming of customer-defined input/output frequencies and smbus power up default; allows exact optimization to customer requirements. ? oe# pins; support dif power management ? 8mhz - 40mhz input frequency with 9fgl04p1 device (25mhz default); flexibility ? pin/smbus selectable 0%, -0.25% or -0.5% spread on dif outputs %; minimize emi and phase jitter for each application ? dif outputs blocked until pll is locked; clean system start-up ? two selectable smbus addresse s; multiple devices can easily share an smbus segment ? space saving 32-pin 5x5mm vfqfpn; minimal board space block diagram note: resistors default to internal on 41/51 devices. p1 devices ha ve programmable default impedances on an output-by-output basis. xin/clkin_25 x2 vss_en_tri ^ckpwrgd_pd# sdata_3.3 ref voe(3:0)# sclk_3.3 vsadr dif0 4 603-25-150ja4i 25mhz ssc capable pll control logic dif1 dif2 dif3
4-output 3.3v pcie clock generator 2 october 19, 2016 9fgl04 datasheet pin configuration smbus address selection table power management table power connections vss_en_tri ^ckpwrgd_pd# gnd voe3# dif3# dif3 gnd vddo3.3 32 31 30 29 28 27 26 25 gndxtal 1 24 voe2# xin/clkin_25 2 23 dif2# x2 3 22 dif2 vddxtal3.3 4 21 vdda3.3 vddref3.3 5 20 gnda vsadr/ref3.3 6 19 dif1# gndref 7 18 dif1 gnddig 817voe1# 9 10111213141516 vdddig3.3 sclk_3.3 sdata_3.3 voe0# dif0 dif0# gnd vddo3.3 9fgl04xx epad is gnd 32-pin vfqfpn, 5x5 mm, 0.5mm pitch v prefix indicates internal 120kohm pull down resistor ^ prefix indicates internal 120kohm pull up resistor sadr address 0 1101000 1 1101010 state of sadr on first application of ckpwrgd_pd# + read/write bit x x true o/p comp. o/p 0xx low 1 low 1 hi-z 2 1 1 0 running running running 111 disabled 1 disabled 1 running 10x disabled 1 disabled 1 disabled 4 1. the output state is set by b11[1:0] (low/low default) 3. input polarities defined at default values for 9fglxx41/xx51. 4. see smbus description for byte 3, bit 4 2. ref is hi-z until the 1st assertion of ckpwrgd_pd# high. after this, when ckpwrg_pd# is low, ref is disabled unless byte3[5]=1, in which case ref is running.. ckpwrgd_pd# smbus oe bit oex# pin difx/difx# ref pin number vdd gnd 41 57 98, 30 16, 25 15, 26, 33 21 20 pll analog ref output description xtal analog digital power dif outputs
october 19, 2016 3 4-output 3. 3v pcie clock generator 9fgl04 datasheet pin descriptions pin# pin name type pin description 1 gndxtal gnd gnd for xtal 2 xin/clkin_25 in crystal input or reference clock input. nominally 25mhz. 3 x2 out crystal output. 4 vddxtal3.3 pwr power supply for xtal, nominal 3.3v 5 vddref3.3 pwr vdd for ref output. nominal 3.3v. 6 vsadr/ref3.3 latched i/o latch to select smbus address/3.3v lvcmos copy of x1/refin pin 7 gndref gnd ground pin for the ref outputs. 8 gnddig gnd ground pin for digital circuitry 9 vdddig3.3 pwr 3.3v digital power (dirty power) 10 sclk_3.3 in clock pin of smbus circuitry, 3.3v tolerant. 11 sdata_3.3 i/o data pin for smbus circuitry, 3.3v tolerant. 12 voe0# in active low input for enabling dif pair 0. this pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 13 dif0 out differential true clock output 14 dif0# out differential complementary clock output 15 gnd gnd ground pin. 16 vddo3.3 pwr power supply for outputs,nominal 3.3v. 17 voe1# in active low input for enabling dif pair 1. this pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 18 dif1 out differential true clock output 19 dif1# out differential complementary clock output 20 gnda gnd ground pin for the pll core. 21 vdda3.3 pwr 3.3v power for the pll core. 22 dif2 out differential true clock output 23 dif2# out differential complementary clock output 24 voe2# in active low input for enabling dif pair 2. this pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 25 vddo3.3 pwr power supply for outputs,nominal 3.3v. 26 gnd gnd ground pin. 27 dif3 out differential true clock output 28 dif3# out differential complementary clock output 29 voe3# in active low input for enabling dif pair 3. this pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 30 gnd gnd ground pin. 31 ^ckpwrgd_pd# in input notifies device to sample latched inputs and start up on first high assertion. low enters power down mode, subsequent high assertions exit power down mode. this pin has internal pull-up resistor. 32 vss_en_tri latched in latched select input to select spread spectrum amount at initial power up : 1 = -0.5% spread, m = -0.25%, 0 = spread off 33 epad gnd connect to ground
4-output 3.3v pcie clock generator 4 october 19, 2016 9fgl04 datasheet test loads alternate terminations the 9fgl family can ea sily drive lvpecl, lvds, and cml logic. see ?an-891 driving lvpecl, lvds, and cml logic with idt's "universal" low-power hcsl outputs? for details. ref output 33 ref output test load 5pf zo = 50 ohms rs rs low-power differential output test load 2pf 2pf 5 inches zo=100ohm note: the device can drive transmission line lengths greater than those specified by the pcie sig terminations device zo ( ? )rs ( ? ) 9fgl0441 100 none needed 9fgl0451 100 7.5 9fgl04p1 100 prog. 9fgl0441 85 n/a 9fgl0451 85 none needed 9fgl04p1 85 prog.
october 19, 2016 5 4-output 3. 3v pcie clock generator 9fgl04 datasheet absolute maximum ratings stresses above the ratings listed below ca n cause permanent damage to the 9fgl04. t hese ratings, which are standard values for idt commercially rated parts, are stress ratings only. function al operation of the device at these or any other conditions above those indicated in the operational sections of the specif ications is not implied. exposur e to absolute maximum rating conditions for extended periods can affect product reliability. electrical parameters are guaranteed only over the recommended operating temperature range. electrical characteris tics?smbus parameters parameter symbol conditions min typ max units notes supply voltage vddx -0.5 4.6 v 1,2 input voltage v in -0.5 v dd +0.5 v 1,3 input high voltage, smbus v ihsmb smbus clock and data pins 3.9 v 1 storage temperature ts -65 150 c 1 junction temperature tj 125 c 1 input esd protection esd prot human body model 2500 v 1 1 guaranteed by design and characterization, not 100% tested in production. 2 operation under these conditions is neither implied nor guaranteed. 3 not to exceed 4.6v. ta = t amb; supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max units notes smbus input low voltage v ilsmb v ddsmb = 3.3v 0.8 v smbus input high voltage v ihsmb v ddsmb = 3.3v 2.1 3.6 v smbus output low voltage v olsmb @ i pullup 0.4 v smbus sink current i pullup @ v ol 4ma nominal bus voltage v ddsmb 2.7 3.6 v sclk/sdata rise time t rsmb (max vil - 0.15) to (min vih + 0.15) 1000 ns 1 sclk/sdata fall time t fsmb (min vih + 0.15) to (max vil - 0.15) 300 ns 1 smbus operating frequency f smb smbus operating frequency 500 khz 2 1 guaranteed by design and characterization, not 100% tested in production. 2. the device must be powered up for the smbus to function.
4-output 3.3v pcie clock generator 6 october 19, 2016 9fgl04 datasheet electrical characteristics?input/supply /common parameters?normal operating conditions ta = t amb; supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max units notes supply voltage vddxxx supply voltage for core, analog and single-ended lvcmos outputs. 3.135 3.3 3.465 v ambient operating temperature t amb industrial range -40 25 85 c input high voltage v ih 0.75 v ddx v ddx + 0.3 v input low voltage v il -0.3 0.25 v ddx v input high voltage v ihtri 0.75 v ddx v dd + 0.3 v input mid voltage v imtri 0.4 v ddx 0.5 v ddx 0.6 v ddx v input low voltage v iltri -0.3 0.25 v ddx v i in single-ended inputs, v in = gnd, v in = vdd -5 5 ua i inp single-ended inputs v in = 0 v; inputs with internal pull-up resistors v in = vdd; inputs with internal pull-down resistors -50 50 ua input frequency f in xtal, or x1 input 8 25 40 mhz 4 pin inductance l p in 7nh1 c in logic inputs, except dif_in 1.5 5 pf 1 c out output pin capacitance 6 pf 1 clk stabilization t stab from v dd power-up and after input clock stabilization or de-assertion of pd# to 1st clock 0.34 1.8 ms 1,2 ss modulation frequency f mod allowable frequency (triangular modulation) 30 31.6 33 khz 1 oe# latency t latoe# dif start after oe# assertion dif stop after oe# deassertion 1 3 clocks 1,3 tdrive_pd# t drvpd dif output enable after pd# de-assertion 300 us 1,3 tfall t f fall time of single-ended control inputs 5 ns 1,2 trise t r rise time of single-ended control inputs 5 ns 1,2 1 guaranteed by design and characterization, not 100% tested in production. 2 control input must be monotonic from 20% to 80% of input swing. 3 time from deassertion until outputs are >200 mv 4 the 9fglxxp1 devices can be programmed for various input frequencies from 8 to 40mhz. the 9fglxx41/51 devices use 25mhz. input current single-ended inputs, except smbus single-ended tri-level inputs ('_tri' suffix) capacitance
october 19, 2016 7 4-output 3. 3v pcie clock generator 9fgl04 datasheet electrical characteristics? dif low-power hcsl outputs ta = t amb; supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max units notes scope avera g in g on, fast settin g 1.9 2.7 4 v/ns 2,3 scope averaging, slow setting 1 2.0 3 v/ns 2,3 crossing voltage (abs) vcross_abs scope averaging off 250 405 550 mv 1,4,5 crossing voltage (var) -vcross scope averaging off 14 140 mv 1,4,9 avg. clock period accuracy t period_avg -100 0 +2600 ppm 2,10,13 absolute period t period_abs includes jitter and spread spectrum modulation 9.847 10 10.203 ns 2,6 jitter, cycle to cycle t j c y c-c y c 37 50 ps 2,15 voltage high v hi gh 660 766 850 1 voltage low v low -150 21 150 1 absolute max voltage vmax 797 1150 1,7,15 absolute min voltage vmin -300 -22 1,8,15 duty cycle t dc 45 49.4 55 % 2 slew rate matching trf 8 20 % 1,14 skew, output to output t sk3 averaging on, v t = 50% 21 50 ps 2 2 measured from differential waveform. 8 defined as the minimum instantaneous voltage including undershoot. 15 at default smbus amplitude settings. 14 matching applies to rising edge rate for refclk+ and falling edge rate for refclk-. it is measured using a 75 mv window cente red on the median cross point where refclk+ rising meets refclk- falling. the median cross point is used to calculate the voltage thre sholds the oscilloscope is to use for the edge rate calculations. the rise edge rate of refclk+ should be compared to the fall edge ra te of refclk-; the maximum allowed difference should not exceed 20% of the slowest edge rate. 1 measured from single-ended waveform. 3 measured from -150 mv to +150 mv on the differential waveform (derived from refclk+ minus refclk-). the signal must be monotoni c through the measurement region for rise and fall time. the 300 mv measurement window is centered on the differential zero cross ing. 4 measured at crossing point where the instantaneous voltage value of the rising edge of refclk+ equals the fa lling edge of refclk-. 5 refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. refers to a ll crossing points for this measurement. 6 defines as the absolute minimum or maximum instantaneous period. this includes cycle to cycle jitter, relative ppm tolerance, and spread spectrum modulation. 7 defined as the maximum instantaneous volta g e includin g overshoot. 9 defined as the total variation of all crossing voltages of rising refclk+ and falling refclk-. this is the maximum allowed var iance in v cross for any particular system. 10 refer to section 4.3.7.1.1 of the pci ex p ress base s p ecification , revision 3.0 for information re g ardin g ppm considerations. 11 system board compliance measurements must use the test load. refclk+ and refclk- are to be measured at the load capacitors cl. single ended probes must be used for measurements requiring single ended measurements. either single ended probes with math or differential probe can be used for differential measurements. test load cl = 2 pf. 12 t stable is the time the differential clock must maintain a minimum 150 mv differential voltage after rising/falling edges before it i s allowed to droop back into the vrb 100 mv differential range. 13 ppm refers to parts per million and is a dc absolute period accuracy specification. 1 ppm is 1/1,000,000th of 100.000000 mhz e xactly or 100 hz. for 300 ppm, then we have an error budget of 100 hz/ppm * 300 ppm = 30 khz. the period is to be measured with a frequen cy counter with measurement window set to 100 ms or greater. the 300 ppm applies to systems that do not employ spread spectrum clocking, or that use common clock source. for systems employing spread spectrum clocking, there is an additional 2,500 ppm nom inal shift in maximum period resulting from the 0.5% down spread resulting in a maximum average period specification of +2,800 ppm. mv slew rate trf mv
4-output 3.3v pcie clock generator 8 october 19, 2016 9fgl04 datasheet electrical characteristics?fi ltered phase jitter parameters - pc ie common clocked (cc) architectures electrical characteristics?filtered pha se jitter parameters - pcie separate reference independent spr ead (sris) architectures 3 electrical characteristics?dif lp-hcsl outp ut unfiltered pha se jitter parameters t amb = over the specified operating range. supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max industry limit units notes t jphpcieg1-cc pcie gen 1 20 25 86 ps (p-p) 1,2,3 pcie gen 2 lo band 10khz < f < 1.5mhz (pll bw of 5-16mhz or 8-5mhz, cdr = 5mhz) 0.5 0.6 3 ps (rms) 1,2 pcie gen 2 high band 1.5mhz < f < nyquist (50mhz) (pll bw of 5-16mhz or 8-5mhz, cdr = 5mhz) 1.3 1.6 3.1 ps (rms) 1,2 t jphpcieg3-cc pcie gen 3 (pll bw of 2-4mhz or 2-5mhz, cdr = 10mhz) 0.36 0.50 1 ps (rms) 1,2 t jphpcieg4-cc pcie gen 4 (pll bw of 2-4mhz or 2-5mhz, cdr = 10mhz) 0.36 0.50 0.5 ps (rms) 1,2 1 applies to all outputs. phase jitter t jphpcieg2-cc 2 based on pcie base specification rev4.0 version 0.7draft. see http://www.pcisig.com for latest specifications. 3 sample size of at least 100k cycles. this figures extrapolates to 108ps pk-pk @ 1m cycles for a ber of 1-12. t amb = over the specified operating range. supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max industry limit units notes t jphpcieg2- sris pcie gen 2 (pll bw of 16mhz , cdr = 5mhz) 0.7 1.1 2 ps (rms) 1,2 t jphpcieg3- sris pcie gen 3 (pll bw of 2-4mhz or 2-5mhz, cdr = 10mhz) 0.5 0.65 0.7 ps (rms) 1,2 1 applies to all outputs. phase jitter, pll mode 2 based on pcie base specification rev3.1a. these filters are different than common clock filters. see http://www.pcisig.com for latest specifications. there is a proposal to reduce the pcie gen3 limit to 0.5ps. 3 as of pcie base specification rev4.0 draft 0.7, sris is not currently defined for gen1 or gen4. ta = t amb; supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max industry limit units phase jitter, 12k-20m t jph12k20m 100mhz outputs with ref output enabled ssc off 1.5 2 n/a ps (rms)
october 19, 2016 9 4-output 3. 3v pcie clock generator 9fgl04 datasheet electrical characteristi cs?current consumption electrical characteristics? ref ta = t amb; supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max units notes i ddaop vdda, all outputs active @100mhz 13 16 ma i ddop all other vdd, except vdda, all outputs active @100mhz 29 40 ma i ddap d vdda, dif outputs off, ref output r unning 0.7 1.5 ma 1 i ddpd all other vdd, except vdda, dif outputs off, ref output r unning 8.8 14 ma 1 i ddapd vdda, all outputs off 0.7 1.5 ma i ddpd all other vdd, except vdda, all outputs off 4.7 8 ma 1 this is the current required to have the ref output running in wake-on-lan mode (byte 3, bit 5 = 1) powerdown current (power down state and byte 3, bit 5 = '0') operating supply current wake-on-lan current (power down state and byte 3, bit 5 = '1') ta = t amb; supply voltages per normal operation conditions, see test loads for loading conditions parameter symbol conditions min typ max units notes long accuracy ppm see tperiod min-max values ppm 1,2 clock period t p eriod ref output ns 2 high output voltage v hi gh i oh = -2ma 0.8xv ddref v low output voltage v low i ol = 2ma 0.2xv ddre f v t rf1 byte 3 = 1f, v oh = 0.8*vdd, v ol = 0.2*vdd 0.5 0.9 1.2 v/ns 1 t rf1 byte 3 = 5f, voh = 0.8*vdd, vol = 0.2*vdd 1.0 1.5 2.0 v/ns 1,3 t rf1 byte 3 = 9f, voh = 0.8*vdd, vol = 0.2*vdd 1.5 2.2 2.6 v/ns 1 t rf1 byte 3 = df, voh = 0.8*vdd, vol = 0.2*vdd 2.0 2.9 3.2 v/ns 1 duty cycle d t1x v t = vdd/2 v 45 50.2 55 % 1,4 duty cycle distortion d tcd v t = vdd/2 v -1 -0.5 0 % 1,5 jitter, cycle to cycle t j c y c-c y c v t = vdd/2 v 70 150 ps 1,4 t j dbc1k 1khz offset -145 -135 dbc 1,4 t j dbc10k 10khz offset to nyquist -150 -140 dbc 1,4 t jphref 12khz to 5mhz, dif ssc off 0.13 0.3 ps (rms) 1,4 t jphref 12khz to 5mhz, dif ssc on 1.5 2 ps (rms) 1,4 1 guaranteed by design and characterization, not 100% tested in production. 3 default smbus value 4 when driven by a crystal. 5 when driven by an external oscillator via the x1 pin, x2 should be floating. noise floor jitter, phase 2 all lon g term accuracy and clock period specifications are g uaranteed assumin g that ref is trimmed to 25.00 mhz 0 40 rise/fall slew rate
4-output 3.3v pcie clock generator 10 october 19, 2016 9fgl04 datasheet general smbus serial interface information how to write ? controller (host) sends a start bit ? controller (host) sends the write address ? idt clock will acknowledge ? controller (host) sends the beginning byte location = n ? idt clock will acknowledge ? controller (host) sends the byte count = x ? idt clock will acknowledge ? controller (host) starts sending byte n through byte n+x-1 ? idt clock will acknowledg e each byte one at a time ? controller (host) sends a stop bit note: smbus read/write addr ess is latched on sadr pin. unless otherw ise indicated, default values are for the xx41 and xx51. p1 devices are fully factory programmable. how to read ? controller (host) will send a start bit ? controller (host) sends the write address ? idt clock will acknowledge ? controller (host) sends the beginning byte location = n ? idt clock will acknowledge ? controller (host) will send a separate start bit ? controller (host) sends the read address ? idt clock will acknowledge ? idt clock will send the data byte count = x ? idt clock sends byte n+x-1 ? idt clock sends byte 0 through byte x (if x (h) was written to byte 8) ? controller (host) will need to acknowledge each byte ? controller (host) will send a not acknowledge bit ? controller (host) will send a stop bit index block write operation controller (host) idt (slave/receiver) tstart bit slave address wr write ack beginning byte = n ack data byte count = x ack beginning byte n x byte ack o o o o o o byte n + x - 1 ack pstop bit index block read operation controller (host) idt (slave/receiver) tstart bit slave address wr write ack beginning byte = n ack rt repeat start slave address rd read ack data byte count=x ack x byte beginning byte n ack o o o o o o byte n + x - 1 n not acknowledge pstop bit
october 19, 2016 11 4-output 3.3v pcie clock generator 9fgl04 datasheet smbus table: output enable register byte 0 name control function type 0 1 default bit 7 x bit 6 x bit 5 x bit 4 x bit 3 dif oe3 output enable rw low/low pin control 1 bit 2 dif oe2 output enable rw low/low pin control 1 bit 1 dif oe1 output enable rw low/low pin control 1 bit 0 dif oe0 output enable rw low/low pin control 1 smbus table: ss readback and vhigh control register byte 1 name control function type 0 1 default bit 7 ssenrb1 ss enable readback bit1 r latch bit 6 ssenrb1 ss enable readback bit0 r latch bit 5 ssen_swcntrl e nable sw control of ss rw ss control locked values in b1[4:3] control ss amount. 0 bit 4 ssensw1 ss enable software ctl bit1 rw 1 0 bit 3 ssensw0 ss enable software ctl bit0 rw 1 0 bit 2 x bit 1 amplitude 1 rw 00 = 0.6v 01= 0.68v 1 bit 0 amplitude 0 rw 10 = 0.75v 11 = 0.85v 0 1. b1[5] must be set to a 1 for these bits to have any effect on the part. these values are for xx41, and xx51. p1 is factory programma b smbus table: dif slew rate control register byte 2 name control function type 0 1 default bit 7 x bit 6 x bit 5 x bit 4 x bit 3 slewratesel dif3 adjust slew rate of dif3 rw slow setting fast setting 1 bit 2 slewratesel dif2 adjust slew rate of dif2 rw slow setting fast setting 1 bit 1 slewratesel dif1 adjust slew rate of dif1 rw slow setting fast setting 1 bit 0 slewratesel dif0 adjust slew rate of dif0 rw slow setting fast setting 1 note: see "low-power hcsl outputs" table for slew rates. smbus table: ref control register byte 3 name control function type 0 1 default bit 7 rw 00 = slowest 01 =slow 0 bit 6 rw 10 = fast 11 = fastest 1 bit 5 ref power down function wake-on-lan enable for ref rw ref disabled in power down ref runs in power down 0 bit 4 ref oe ref output enable rw disabled enabled 1 bit 3 x bit 2 x bit 1 x bit 0 x byte 4 is reserved 00' for ss_en_tri = 0, '01' for ss_en_tri = 'm', '11 for ss_en_tri = '1' reserved reserved reserved reserved 1. a low on these bits will overide the oe# pin and force the differential output to the state indicated by b11[1:0] (low/low d efault). reserved reserved reserved 00' = ss off, '01' = -0.25% ss, '10' = reserved, '11'= -0.5% ss reserved controls output amplitude reserved reserved reserved reserved ref slew rate control reserved
4-output 3.3v pcie clock generator 12 october 19, 2016 9fgl04 datasheet smbus table: revision and vendor id register byte 5 name control function type 0 1 default bit 7 rid3 r 0 bit 6 rid2 r 0 bit 5 rid1 r 0 bit 4 rid0 r 1 bit 3 vid3 r 0 bit 2 vid2 r 0 bit 1 vid1 r 0 bit 0 vid0 r 1 smbus table: device type/device id byte 6 name control function type 0 1 default bit 7 device type1 r 0 bit 6 device type0 r 0 bit 5 device id5 r 0 bit 4 device id4 r 0 bit 3 device id3 r 0 bit 2 device id2 r 1 bit 1 device id1 r 0 bit 0 device id0 r 0 smbus table: byte count register byte 7 name control function type 0 1 default bit 7 x bit 6 x bit 5 x bit 4 bc4 rw 0 bit 3 bc3 rw 1 bit 2 bc2 rw 0 bit 1 bc1 rw 0 bit 0 bc0 rw 0 bytes 8 and 9 are reserved smbus table: pd_restore byte 10 name control function type 0 1 default bit 7 reserved reserve bit, leave at default rw reserved reserved 0 bit 6 power-down (pd) restore restore default config. in pd rw clear config in pd keep config in pd 1 bit 5 x bit 4 x bit 3 x bit 2 x bit 1 x bit 0 x revision id b rev = 0001 vendor id 0001 = idt reserved device type 00 = fgx, 01 = dbx, 10 = dmx, 11= dbx w/opll device id 000100 binary or 04 hex reserved reserved reserved byte count programming writing to this register will configure how many bytes will be read back, default is = 8 bytes. reserved reserved reserved reserved reserved
october 19, 2016 13 4-output 3.3v pcie clock generator 9fgl04 datasheet smbus table: stop state control byte 11 name control function type 0 1 default bit 7 x bit 6 x bit 5 x bit 4 x bit 3 x bit 2 x bit 1 stp[1] rw 00 = low/low 10 = high/low 0 bit 0 stp[0] rw 01 = hiz/hiz 11 = low/high 0 smbus table: impedance control byte 12 name control function type 0 1 default bit 7 dif1_imp[1] dif1 zout rw 00=33  dif zout 10=100  dif zout bit 6 dif1_imp[0] dif1 zout rw 01=85  dif zout 11 = reserved bit 5 x bit 4 x bit 3 dif0_imp[1] dif0 zout rw 00=33  dif zout 10=100  dif zout bit 2 dif0_imp[0] dif0 zout rw 01=85  dif zout 11 = reserved bit 1 x bit 0 x smbus table: impedance control byte 13 name control function type 0 1 default bit 7 x bit 6 x bit 5 dif3_imp[1] dif3 zout rw 00=33  dif zout 10=100  dif zout bit 4 dif3_imp[0] dif3 zout rw 01=85  dif zout 11 = reserved bit 3 dif2_imp[1] dif2 zout rw 00=33  dif zout 10=100  dif zout bit 2 dif2_imp[0] dif2 zout rw 01=85  dif zout 11 = reserved bit 1 x bit 0 x smbus table: pull-up pull-down control byte 14 name control function type 0 1 default bit 7 oe1_pu/pd[1] rw 00=none 10=pup 0 bit 6 oe1_pu/pd[0] rw 01=pdwn 11 = pup+pdwn 1 bit 5 x bit 4 x bit 3 oe0pu/pd[1] rw 00=none 10=pup 0 bit 2 oe0_pu/pd[0] rw 01=pdwn 11 = pup+pdwn 1 bit 1 x bit 0 x see note reserved reserved reserved reserved reserved reserved true/complement dif output disable state reserved reserved oe0pull-up(pup)/ pull-down(pdwn) control reserved reserved oe1 pull-up(pup)/ pull-down(pdwn) control reserved reserved see note reserved reserved reserved reserved see note see note reserved reserved
4-output 3.3v pcie clock generator 14 october 19, 2016 9fgl04 datasheet smbus table: pull-up pull-down control byte 15 name control function type 0 1 default bit 7 x bit 6 x bit 5 oe3_pu/pd[1] rw 00=none 10=pup 0 bit 4 oe3_pu/pd[0] rw 01=pdwn 11 = pup+pdwn 1 bit 3 oe2_pu/pd[1] rw 00=none 10=pup 0 bit 2 oe2_pu/pd[0] rw 01=pdwn 11 = pup+pdwn 1 bit 1 x bit 0 x smbus table: pull-up pull-down control byte 16 name control function type 0 1 default bit 7 0 bit 6 0 bit 5 1 bit 4 0 bit 3 0 bit 2 1 bit 1 ckpwrgd_pd_pu/pd[1] rw 00=none 10=pup 1 bit 0 ckpwrgd_pd_pu/pd[0] rw 01=pdwn 11 = pup+pdwn 0 byte 17 is reserved smbus table: polarity control byte 18 name control function type 0 1 default bit 7 0 bit 6 oe3_polarity sets oe3 polarity rw enabled when low enabled when high 0 bit 5 oe2_polarity sets oe2 polarity rw enabled when low enabled when high 0 bit 4 0 bit 3 oe1_polarity sets oe1 polarity rw enabled when low enabled when high 0 bit 2 0 bit 1 oe0_polarity sets oe0 polarity rw enabled when low enabled when high 0 bit 0 0 smbus table: polarity control byte 19 name control function type 0 1 default bit 7 0 bit 6 0 bit 5 0 bit 4 0 bit 3 0 bit 2 0 bit 1 0 bit 0 ckpwrgd_pd determines ckpwrgd_pd polarity rw power down when low power down when high 0 reserved reserved reserved reserved reserved reserved ckpwrgd_pd pull-up(pup)/ pull-down(pdwn) control reserved oe3 pull-up(pup)/ pull-down(pdwn) control oe2 pull-up(pup)/ pull-down(pdwn) control reserved reserved reserved reserved reserved reserved reserved reserved reserved reserved reserved reserved reserved reserved
october 19, 2016 15 4-output 3.3v pcie clock generator 9fgl04 datasheet recommended crystal char acteristics ( 3225 package) marking diagrams notes: 1. ?lot? is the lot sequence number. 2. ?coo? denotes country of origin. 3. ?yyww? is the last two digits of the year and week that the part was assembled. 4. line 2: truncated part number. 5. ?l? denotes rohs compliant package. 6. ?i? denotes industrial temperature range device. 7. ?p? denotes factory programmable defaults. thermal characteristics parameter value units notes frequency 25 mhz 1 resonance mode fundamental - 1 frequency tolerance @ 25c 20 ppm max 1 frequency stability, ref @ 25c over operating temperature range 20 ppm max 1 temperature range (commerical) 0~70 c 1 temperature range (industrial) -40~85 c 1 equivalent series resistance (esr) 50 ? max 1 shunt capacitance (c o )7pf max1 load capacitance (c l )8pf max1 drive level 0.3 mw max 1 aging per year 5 ppm max 1 notes: 1. fox 603-25-150 ics l0441bil yyww coo lot ics l0451bil yyww coo lot ics 4p1b000i yyww coo lot parameter symbol conditions pkg typ. units notes jc junction to case 42 c/w 1 c/w 1 c/w 1 c/w 1 c/w 1 ja5 junction to air, 5 m/s air flow 27 c/w 1 1 epad soldered to board thermal resistance nlg32
4-output 3.3v pcie clock generator 16 october 19, 2016 9fgl04 datasheet package outline and package dimensions (nlg32) ? use epad option p1
october 19, 2016 17 4-output 3.3v pcie clock generator 9fgl04 datasheet ordering information ?lf? suffix to the part number are the pb-free configuration and are rohs compliant. ?b? is the device revision designator (wil l not correlate with the datasheet revision). ?xxx? is a unique factory assigned number to identify a particular default configuration. revision history part / order numbe r notes shipping packaging package temperature 9FGL0441BKILF trays 32-pin vfqfpn -40 to +85 c 9FGL0441BKILFt tape and reel 32-pin vfqfpn -40 to +85 c 9fgl0451bkilf trays 32-pin vfqfpn -40 to +85 c 9fgl0451bkilft tape and reel 32-pin vfqfpn -40 to +85 c 9fgl04p1bxxxkilf trays 32-pin vfqfpn -40 to +85 c 9fgl04p1bxxxkilf t tape and reel 32-pin vfqfpn -40 to +85 c 100 ? 85 ? factory configurable. contact idt for addtional information. rev. issue date intiator description page # a 7/16/2015 rdw 1. update electrical tables with characterization data. 2. minor formatting updates for readab ility and consistency. 3. added i-temp crystal part number to crystal characteristics table 4. added reference to an-891 for terminating to other logic fam ilies. 5. removed lvds termination drawing (now in an-891) various b 8/6/2015 rdw 1. clarified conditions statement for iddop parameters in the current consumption table. 8 c 2/4/2016 rdw 1. updated ordering information to b rev 2. updated byte 5 values 3. updated block diagram various d 4/20/2016 rdw 1. removed vddio reference, this part does not have the feature 2. clarified that the 9fgl04p device has 8mhz to 40mhz input frequency range, and that the 9fgl0441/0451 use a 25mhz input. 3. updated max idd for case wol mode from 11ma to 14ma. 4. corrected stop state control bit decode in byte 11 5. updated amplitude control bit decode in byte 1 e 6/3/12016 rdw 1. update electrical tables for b rev production release 2. added pcie sris and pcie gen4 cc to phase jitter tables. 3. updated front page text. 4. removed '000' blank device from ordering information. 5. updated byte0 wording for clarity 6. updated byte1[1:0] descriptions. various f 6/22/12016 rdw 1. updated electrical tables with final data from pe/te various g 10/18/2016 rdw removed idt crystal part number
disclaimer integrated device technology, inc. (idt) and its subsidiaries reserve the right to modify the products and/or specifications d escribed herein at any time and at idt?s sole discretion. all information in this document, including descriptions of product features and performance, is subject to change without notice. performance spe cifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. the information co ntained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limi ted to, the suitab ility of idt?s products for any particular purpose, an implied war ranty of merchantability, or non-infringement of the intellectual property rights of others. this document is presented only as a guide and does not convey any license under intellectual property rights of idt or any third pa rties. idt?s products are not intended for use in applications involvin g extreme environmental conditions or in life support systems o r similar devices where the failure or malfun ction of an idt product can be reasonably expected to significantly affect the health or safety of users. anyone using an idt product in such a manner does so at their o wn risk, absent an express, written agreement by idt. integrated device technology, idt and the idt logo are registered trademarks of idt. product specification subject to change wi thout notice. other trademarks and service marks used herein, including protected names, logos and designs, are the property of idt or their respective third party owners. copyright ?2016 integrated device technology, inc.. all rights reserved. corporate headquarters 6024 silver creek valley road san jose, ca 95138 usa www.idt.com sales 1-800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com/go/sales tech support www.idt.com/go/support


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